《Ieee Transactions On Components Packaging And Manufacturing Technology》是一本由Institute of Electrical and Electronics Engineers Inc.出版商出版的专业工程技术期刊，该刊创刊于2011年，刊期12 issues/year，该刊已被国际权威数据库SCI、SCIE收录。在中科院最新升级版分区表中，该刊分区信息为大类学科：工程技术 3区，小类学科：工程：电子与电气 3区；材料科学：综合 3区；工程：制造 4区；在JCR（Journal Citation Reports）分区等级为Q3。该刊发文范围涵盖工程：电子与电气等领域，旨在及时、准确、全面地报道国内外工程：电子与电气工作者在该领域取得的最新研究成果、工作进展及学术动态、技术革新等，促进学术交流，鼓励学术创新。2021年影响因子为1.922，平均审稿速度一般,3-6周。

Ieee Transactions On Components Packaging And Manufacturing Technology英文介绍

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

Ieee Transactions On Components Packaging And Manufacturing Technology中科院分区

大类学科	分区	小类学科	分区	Top期刊	综述期刊
工程技术	3区	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学：综合 ENGINEERING, MANUFACTURING 工程：制造	3区 3区 4区	否	否

Ieee Transactions On Components Packaging And Manufacturing Technology期刊近9年JCR分区变化趋势

Ieee Transactions On Components Packaging And Manufacturing TechnologyJCR分区(JCR2021-2022年分区)

JCR分区等级	JCR所属学科	分区	影响因子
Q3	ENGINEERING, ELECTRICAL & ELECTRONIC	Q3	1.922
	ENGINEERING, MANUFACTURING	Q4
	MATERIALS SCIENCE, MULTIDISCIPLINARY	Q4

Ieee Transactions On Components Packaging And Manufacturing Technology期刊近7年影响因子变化趋势

Ieee Transactions On Components Packaging And Manufacturing Technology期刊的CiteScore值(CiteScore2021-2022年CiteScore值)

CiteScore	SJR	SNIP	学科类别	分区	排名	百分位
4.10	0.623	1.032	大类：Engineering 小类：Industrial and Manufacturing Engineering	Q2	109 / 338	67%
			大类：Engineering 小类：Electrical and Electronic Engineering	Q2	254 / 708	64%
			大类：Engineering 小类：Electronic, Optical and Magnetic Materials	Q2	106 / 259	59%

Ieee Transactions On Components Packaging And Manufacturing Technology期刊近7年自引率变化趋势

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